Westchester Avenue Purchase, NY -- (SBWire) --05/12/2011 --TimeLink®, a leading Enterprise Workforce Management company today announced that it will exhibit at the 29th Annual APA Congress at the Salt Palace Convention Center in Salt Lake City, Utah.
This premier payroll event of the year will be held from May 24-27, 2011. Booth 619 is set to receive an excellent response as TimeLink will exhibit its proven capabilities as a leader in developing enterprise ready solutions focused around Time and Attendance, Workforce Scheduling, Leave Management, and Labor Planning. Their comprehensive solution set is available through TimeLink Enterprise Edition (http://www.timelink.com/enterprise_edition.html) or TimeLink OnDemand Edition (http://www.timelink.com/ondemand_edition.html) and can be implemented for any business across multiple industries such as retail, healthcare, education, public sector, services and manufacturing.
Another exciting highlight will be the return of TimeLink's 'Punch-in-to-Win'. Attendees will have the opportunity to bring their TimeLink badge (which will be mailed to attendees) to the TimeLink booth in hopes of winning exciting prizes such as an iPod touch, iPod shuffle, iTunes Gift Cards, TimeLink Premium Travel Mugs, TimeLink Premium Pens, TimeLink Coffee Mugs and TimeLink Green Bags.
The Annual APA Congress has remained a center of industry attraction for the past 28 years. Professionals looking to enhance education and networking opportunities in the payroll, accounts payable, finance and HR fields have always gained a great deal from this event.
"Congress is such a rewarding experience. The value we receive from networking with our peers and vendors is amazing, and the continued education is necessary to do our jobs and stay on top of changing legislation." ~said Barbara Muellerleile, CPP Director, Finance/Payroll Regis Corporation.
Presence of exhibitors like TimeLink will definitely add value to this event which is expected to have over 2000 attendees.
TimeLink to Exhibit at the 29th Annual APA Congress Booth 619