Lead-Free Solder Balls Market to Receive Overwhelming Hike in Revenues by 2025
A solder ball, also known as solder bump, is a globe or sphere of solder that provides a contact between the chip package and the printed circuit board. It is used to facilitate the soldering process. The ball is placed by an automated equipment or manually over the flux. This helps the ball to be held in place. The alloy is used to join two metal surfaces through melting so that it forms a thin layer between the surfaces. Solder...
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