Flip Chip Market Is Touching New Levels – To Grow at a CAGR of 6.41% by 2024: Intel, Global Foundries, Samsung Group
Flip Chip, also known as direct chip attach, is a process which interconnects chip and package carriers or substrate using a conductive bump. Once the die is connected the stand-off distance between the die and substrate is typically filled with a non-conductive adhesive referred to as underfill.
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