Wafer Level Packaging Market to Reach $7.8 Billion, Globally, by 2022
Wafer Level Packaging Market Report, published by Allied Market Research, forecasts that the global market is expected to garner $7.8 billion by 2022, registering a CAGR of 21.5% from 2016-2022. In the year 2015, Asia-Pacific dominated the global market and contributed over half of the market share owing to improved electronics industry infrastructure and increasing demand of electronic products such as smartphones, handheld devices, PCs and laptops among others.
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