Embedded Die Packaging Technology Market Report Forecasts Healthy Growth by 2022 - Forecast to 2022
Embedded die packaging technology is wherein the die is directly embedded into printed circuit board laminated substrate. This technology is mostly used in manufacturing and it offers several benefits such as power saving, size reduction, and improving the overall system efficiency on a large scale. Embedded die packaging technology can be differentiated broadly into two types, namely, Flip Chip Chip Scale Packaging and Wafer Level Chip Scale Packaging and both these technologies are growing at a steady pace globally. Embedded...
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