Dallas, TX -- (SBWIRE) -- 11/18/2014 -- “Electronic Adhesives Market by Type (Electrically Conductive, Thermally Conductive, UV Curing & others), Form (Liquid, Solid & Paste), Application (Semiconductor & IC and Printed Circuit Boards (PCB)), and Geography – Regional Trends & Forecast to 2019” is a June 2014 publication of 234 pages and it analysis electronic adhesives market as:

The electronic adhesives market was estimated around $3.0 billion in 2013, with the highest share of more than 60% held by Asia-Pacific and RoW together. The global market is projected to grow at a CAGR of 10.1% from 2014 to 2019 to reach $5.5 billion by 2019. The highest investment is projected to be in the Asia-Pacific region due to the growing application markets, especially in China. The electronic adhesives market in the RoW region is estimated to witness the second highest growth at 6.80% from 2014 to 2019.H.B. Fuller (U.S.) and Henkel AG & Company (Germany) are the important active players in the electronic adhesives market. These companies showed the highest strategy adoptions amongst other players in the global electronic adhesives market, accounting for over 60.0% of the total market activities from 2010 to 2014.

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From 2010 to 2014, mergers & acquisitions were observed as the most important growth strategy adopted by the electronic adhesive companies, accounting for a share of 40.0%. The other companies — Alent (U.K.), Hitachi Chemicals (Japan), Dow Corning (U.S.), and Dai Nippon Printing Co. Ltd. (Japan) contributed the other 40% of the market activities in the electronic adhesives market during the period of study. The key companies offering electronic adhesives are mainly involved in acquisitions. The companies rigorously adopt the acquisition strategy to strengthen their position in the electronic adhesives market. The acquired player is sometimes a small player in a new market or a player with high technical expertise. The large players of the market actively participated in expanding their global reach, while the small companies concentrated more on new product developments during 2010 to 2014.

Companies profiled in electronic adhesive market report are BASF SE, Dow Chemicals Co., Henkel Ag & Company, Kgaa, Alent Plc, Hitachi Chemical Co. Ltd., Kyocera Chemical Corporation, H.B. Fuller, The 3m Company, LG Chemical Ltd., Indium Corporation, and Mitsui Chemicals, Inc.

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“Electronic Toll Collection System Market by Products (AVI, AVC, VES, Back office & Integration), Technology (RFID, DRSC, Video Analytics, & GNSS), Applications (Highway, & Urban), & Geography – Analysis & Forecast to 2013 – 2020” is a Feb 2014 publication of 368 pages and it analysis electronic toll collection system market as:

Electronic toll collection system market is expected to grow at a CAGR of 11.1% from 2014 to 2020 and reach $9.5 Billion in 2020. Electronic toll collection system is mainly installed for the ease of transportation. In this system, tolls are collected with the help of electronic equipment installed on the roadside and without reducing the speed of the vehicle or stopping it. An ETC system consists of four segments named Automatic Vehicle Identification (AVI), Automatic Vehicle Characterization (AVC,) Vehicle Enforcement System (VES), and Back Office and Integration. The most important applications of ETC are on highways and in the urban context of congested cities, allowing to charge tolls without vehicles having to slow down. The growing demand for Electronic Toll Collection systems has increasingly shifted focus towards optimization in the areas of efficiency, faster service, and cost. In Global ETC market the major products included are Transponder, Antenna, communication system, Inductive Loop, Treadles, Weigh-In-Motion Device, Light Beam, Scanning device, Video Image Processing Device, Camera, Film Storage Device, and Back Office and Integration.

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The electronic toll collection technologies are generally segmented into radio frequency identification (RFID), dedicated short-range communications (DRSC), video analytics, and global navigation satellite system (GNSS). The two main ETC technology competitions are DSRC and RFID – RFID toll gates is used in North America, while the DSRC is the standard technology used in Europe and Asia with a mixed position and Short-range (RFID/DSRC) versus wide area (GNSS + Cellular). The future growth is mainly focused on wide area technology. The application of Electronic Toll Collection system is found on Highways and Urban Roads. The major driving factors that hold the Electronic Toll Collection market are- no need to halt the vehicle to pay the toll, efficient and faster service, drivers no longer have to be concerned about having cash or precise change on hand, saves money on gas, minimal halts to pay the toll. Major players in this Electronic Toll Collection market are Thales Group (France), EFKON AG (Austria), Kapsch AG (Austria), Hitachi Ltd (Japan), Siemens AG (Germany), MITSUBISHI HEAVY INDUSTRIES LTD (Japan), 3M (U.S.), Q-Free (Norway), Schneider Electric (France), Robert Bosch GmbH (Germany), TransCore (U.S.), Xerox Corporation (U.S.) and TRMI Systems Integration (U.S.).

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