Global System-in-Package Market to Grow at a CAGR of 10.29% During the Period 2016 - 2020; Finds New Report
Report forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020. A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This...
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