Global 3D Semiconductor Packaging Market 2017 - Siliconware Precision Industries Co., Amkor Technology, ASE Group, Ltd., SÜSS MicroTec AG.
Global 3D Semiconductor Packaging Market is estimated to reach $12 Billion by 2024; growing at a CAGR of 15.2% from 2016 to 2024. 3D semiconductor packaging is an innovative packaging technology of semiconductor chips that are manufactured by stacking and interconnecting of silicon wafers, to perform as a single device. Various features such as reduced space consumption, better overall performance, and enhanced efficiency have increased its penetration across various applications areas such as electronics, healthcare, industrial, and IT & Telecommunication,...
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