Latest Research on Global Semiconductor Advanced Packaging Market 2017-2021
Semiconductor packaging is carried out to provide protection to the wafer or substrate. The casing (package) is built from materials such as plastic, metal, glass, or ceramic and contains one or more semiconductor electronic components. Semiconductor advanced packaging is a key component of the semiconductor manufacturing process. The package of a semiconductor device is usually made of materials such as plastic, metal, ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion. It also has contact pins or leads...
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