Lewes, DE -- (SBWIRE) -- 08/16/2017 -- Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass

In the report, Publisher says IDMs dominates the largest Application share in 2017. The objective of report is to define, segment, and project the market on the basis of type, application, and region, and to describe the content about the factors influencing market dynamics, policy, economic, technology and market entry etc.

Based on products type, the report describes major products type share of regional market. Products mentioned as follows:
By Type
Fully Automatic
Semi-Automatic
Manual

Based on region, the report describes major regions market by products and application. Regions mentioned as follows:
Asia-Pacific
North America
Europe
South America
Middle East & Africa

Based on Application, the report describes major Application share of regional market. Application mentioned as follows:
IDMs
OSAT

Leading vendors in the market are included based on profile, business performance etc. Vendors mentioned as follows:
Besi
ASM Pacific Technology(ASMPT)
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Hybond

Spanning over 72 pages "Global Die Bonder Equipment Market Research 2011 - 2022" report covers Market Overview, Industry Chain, Environmental Analysis, Market Segmentation by Type, Market Segmentation by Application, Market Segmentation by Region, Market Competitive, Major Vendors, Conclusion.

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