Lewes, DE -- (SBWIRE) -- 08/12/2015 -- Report forecast the global die-level packaging equipment market to grow at a CAGR of 1.24% during 2014-2019.

ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials. Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.

This report covers the present scenario and growth prospects of the global die-level packaging equipment market for 2015-2019. To calculate the market size, the report considers revenue generated from the sales of die-level packaging equipment worldwide. However, the report does not consider the following while calculating the market size:

- Support or maintenance services offered for/with die-level packaging equipment
- Components used in the production of die-level packaging equipment
- Aftermarket sales of die-level packaging equipment

Global Die-level Packaging Equipment Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.

According to the report, steady growth of semiconductor wafer industry is a major driver that promotes growth in this market. The demand for semiconductor wafers is continually increasing owing to the augmented demand for portable electronic devices globally. Steady growth of semiconductor wafer industry

Key Regions
- Americas
- APAC
- EMEA

Key players in the Global Die-Level Packaging Equipment Market: ASM International NV, BE Semiconductor Industries N.V. (Besi), DISCO Corp., and Kulicke & Soffa Industries Inc.

Other Prominent Vendors in the market are: Cohu, TOWA, Shinkawa, Advantest, and Hitachi High-Technologies.

Market Driver
- Rise in Demand for Smartphones and Tablets
- For a full, detailed list, view our report

Market Challenge
- Rapid Changes in Technology
- For a full, detailed list, view our report

Market Trend
- Short Replacement Cycle of Portable Electronic Devices
- For a full, detailed list, view our report

Key Questions Answered in this Report
- What will the market size be in 2019 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

Spanning over 63 pages "Global Die-level Packaging Equipment Market 2015-2019" report covers Executive Summary, List of Abbreviations, Scope of the Report, Market Research Methodology, Introduction, Industry Overview, Market Landscape, Geographical Segmentation, Buying Criteria, Market Growth Drivers, Drivers and Their Impact, Market Challenges, Impact of Drivers and Challenges, Market Trends, Trends and Their Impact, Vendor Landscape, Key Vendor Analysis.

For further information on this report, please visit-
http://www.marketresearchreports.com/technavio/global-die-level-packaging-equipment-market-2015-2019

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