Lewes, DE -- (SBWIRE) -- 09/10/2015 -- Report forecast the global organic substrate packaging materials market to grow at a CAGR of 5.41% over the period 2014-2019.

Organic substrates are the base layers of individual semiconductor devices and ICs on which other layers are deposited to complete a circuit. As these materials are part of the circuit, it is imperative that they are efficient conductors of electricity, and preferably thinner core materials are used to surround them in demanding system applications. A small die (block of semiconducting material made of silicon or gallium arsenide with a fabricated circuit) is mounted on the substrate, which connects the input and output terminals from the die to a PCB.

Organic substrates are surrounded by low-loss and ultra-thin materials that have a dielectric base. A thin film layer used to protect the semiconductors on the substrate is made of polyamide and polyester films. These materials are mainly used in area array packages such as BGA and PGA.

This report covers the present scenario and the growth prospects of the global organic substrate packaging materials market for the period 2015-2019. The report provides the vendor landscape and a corresponding detailed analysis of the top six vendors in the market.

The market segmentation is done based on the following:

- Packaging technology
- Geography

Global Organic Substrate Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts.

According to the report, LTE 4G network requires base station system on chip (SoC), which doubles the performance of LTE and reduces power consumption. SoC integrates all the components of a circuit on a single chip. It uses IC substrate chips as the base on which the circuit is built. It is available in ball grid packages. SoC has low manufacturing costs because of the presence of fewer packages than multichip systems, and the packaging is simple. Base stations can handle the immense amount of traffic in 4G network only with the use of SoC. Thus, the use of SoC in LTE network is increasing the demand for IC substrate chips, thereby driving the growth of the market.

Key regions
- APAC
- Europe
- North America
- ROW

Key players in the Global Organic Substrate Packaging Material Market: ASE Kaohsiung, AMKOR, SPIL, STATS ChipPAC, Mitsubishi and AJINOMOTO

Market driver
- Demand for wireless devices
- For a full, detailed list, view our report

Market challenge
- Dependency on semiconductor equipment industry performance
- For a full, detailed list, view our report

Market trend
- Popularity of redistributed chip packaging
- For a full, detailed list, view our report

Key questions answered in this report
- What will the market size be in 2019 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

Spanning over 67 pages "Global Organic Substrate Packaging Material Market 2015-2019" report covers Executive Summary, Scope of the Report, Market Research Methodology, Introduction, Market landscape, Market segmentation by packaging technology, Geographical segmentation, Key leading countries, Market drivers, Impact of drivers, Market challenges, Impact of drivers and challenges, Market trends, Vendor landscape, Key vendor analysis, Appendix.

For further information on this report, please visit-
http://www.marketresearchreports.com/technavio/global-organic-substrate-packaging-material-market-2015-2019

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