Pune, India -- (SBWIRE) -- 10/31/2018 -- This study researches the market size of Power Module Packaging in United States, European Union and China, presents the Power Module Packaging production, consumption, value, product price, market share and growth rate by companies, type and application, history breakdown data from 2013 to 2018, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2013 to 2018.

A power electronic module or power module acts as a physical container for the storage of several power components, usually power semiconductor devices.

The market growth is driven by reduction in wastage of energy, use of efficient distributed cooling schemes, reduction in footprint, and consequent increase in power density.

In 2018, the market size of Power Module Packaging is xx million US$ and it will reach xx million US in 2025, growing at a CAGR of xx% from 2018; while in China, the market size is valued at xx million US$ and will increase to xx million US in 2025, with a CAGR of xx% during forecast period.

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In this report, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Power Module Packaging.

In United States, European Union and China market, the following companies are covered:

Texas Instruments Incorporated

Star Automations

DyDac Controls

SEMIKRON

IXYS Corporation

Infineon Technologies AG

Mitsubishi Electric Corporation

Fuji Electric Co. Ltd.

Sanken Electric Co., Ltd.

SanRex Corporation

Market Segment by Product Type

GaN Module

SiC Module

FET Module

IGBT Module

Thyristors

Market Segment by Application

Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)

Motors

Rail Tractions

Wind Turbines

Photovoltaic Equipment

Key Regions split in this report:

United States

China

European Union

Rest of World (Japan, Korea, India and Southeast Asia)

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The study objectives are:

To analyze and research the Power Module Packaging status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.

To present the key Power Module Packaging manufacturers, presenting the sales, revenue, market share, and recent development for key players.

To split the breakdown data by regions, type, companies and applications

To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.

To identify significant trends, drivers, influence factors in global and regions

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

In this study, the years considered to estimate the market size of Power Module Packaging are as follows:

History Year: 2013-2018

Base Year: 2017

Estimated Year: 2018

Forecast Year 2018 to 2025

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