The integration of photonics with electronics revolutionized the microelectronics industry. However, the use of this combination remained limited to high-end devices and applications due to the high cost of optical fibers and other optoelectronic components.

Wilmington, DE -- (SBWire) -- 03/17/2010 -- According to a new market research report, ‘Global Silicon Photonics Market (2009 - 2014)’, published by MarketsandMarkets (www.marketsandmarkets.com), the total global silicon photonics product market is expected to be worth US$1.95 billion by 2014, and the U.S. market will account for nearly 52.9% of the total revenues. The global silicon photonics product market is expected to record a CAGR of 82.7% from 2009 to 2014.

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The integration of photonics with electronics brought about a new lease of life to the industry. But with the high cost of optical fibers and other optoelectronic components, their adoption remained limited to the high end devices and applications. The search for a cheaper base material ended with silicon that began to be used for photonic applications, thus giving birth to the new science-silicon-photonics. When compared with conventional electronics, silicon photonics provide 90% of its efficiency with one-third of power consumption, at one-tenth of the cost and no requirement of additional manufacturing technology. This makes it more attractive for customers and lucrative for manufacturers. The silicon photonics product market is segmented into silicon waveguides, silicon modulators, silicon optical interconnects wavelength division multiplexer filters, silicon LED and silicon photo detector.

In Silicon photonics market, wavelength division multiplex filter is the largest segment, and is expected to be US$620 million by 2014 at a CAGR of 106% from the year 2009 to 2014. The high market size of wavelength division multiplex filters is due to its early commercialization and wide application area in telecommunication. The photo detector market is expected to be US$301 million in 2014.

Early commercialization of products and high absorption rate of electronic products have made U.S. the dominant market in 2008 with 56.7% share of the global silicon photonics product market. Increased research and developments in U.S. companies have also helped it dominate the silicon photonics market. Europe is estimated to be the second largest with 25% share of the market.

The report is titled ‘Global Silicon Photonics Market (2009-2014)' and was published in August 2009.

Scope of the report

This report, aims to identify and analyze products and devices that use silicon photonics technology. The report has segmented the global silicon photonics market as follows:

Silicon photonics product market
Waveguides, modulator, wavelength division multiplex filters, optical interconnect, LED, photo detector

Silicon photonics product device market
Optical switches, IC, optical transceivers, solar cells, sensors

Silicon photonics applications market
Telecommunication, information processing, Sensing, metrology, Displays, consumer electronics, others

Silicon photonics technology market
Silicon submount technology, passive waveguide technology, passive optical alignment

Each section will provide market data, market drivers, trends and opportunities, top-selling products, key players, and competitive outlook. This report will also provide more than 50 market tables for various geographic regions covering the sub-segments and micro-markets. In addition, the report also provides 20 company profiles for each of its sub-segments.

Table of Content

1. Introduction
1.1. KEY TAKE AWAYS
1.2. REPORT DESCRIPTION
1.3. MARKETS COVERED
1.4. STAKEHOLDERS

2. Summary

3. Market overview
3.1. Defining the Silicon photonics market
3.2. Market Drivers
3.2.1. Products are cheaper than conventional ones
3.2.2. Low power consumption advantage
3.2.3. Products are compact in size
3.2.4. Need for high speed electronics
3.2.5. The materials used are well understood
3.2.6. Increase data transfer volume
3.3. Inhibitors
3.3.1. Indirect band gap in silicon
3.3.2. Slow modulation mechanism
3.3.3. posibility of Thermal effect
3.3.4. Pockel’s effect
3.3.5. Silicon is still regarded as new optical material
3.4. Opportunities
3.4.1. Optical modulation is possible
3.4.2. It is possible to achieve V-grooves and hybrid technology
3.4.3. High power devices
3.5. Top player analysis

4. Types of silicon photonic products
4.1. Silicon photonic waveguides
4.1.1. Drivers
4.1.1.1. Wide range of wavelengths
4.1.1.2. Low bending loss of waves
4.1.1.3. Better line-to-line resolution
4.1.1.4. Other drivers of silicon photonic waveguides market
4.1.2. Inhibitors
4.1.2.1. Waveguides become bulky
4.1.2.2. Fabrication difficulties
4.1.3. Opportunities
4.1.3.1. Monolithic waveguides
4.1.4. Planar waveguides
4.1.5. Strip waveguides
4.1.6. Rib Waveguides
4.1.7. Fiber waveguide
4.2. Silicon Optical Modulators
4.2.1. Drivers
4.2.1.1. Data transmission is faster than other modulators
4.2.1.2. Better device packaging
4.2.1.3. Low response time
4.2.1.4. High resistivity to temperature change
4.2.2. Inhibitors
4.2.2.1. Performance depends on doping
4.2.2.2. Critical dimensions are not tolerant
4.2.3. Opportunities
4.2.3.1. New device design approaches
4.2.3.2. Key developments
4.2.4. Absorptive modulators
4.2.4.1. Technologies for Absorptive Modulators
4.2.4.2. Franz-Keldysh Effect
4.2.4.3. Quantum-Confined Stark Effect (QCSE)
4.2.4.4. Plasma Dispersion Effect
4.2.5. Refractive modulators
4.2.5.1. Technologies for refractive silicon photonic modulators
4.2.5.2. Electro-optic effect
4.2.5.3. Magneto-optic effect
4.2.5.4. Thermo-optic effect
4.2.5.5. Polarization changes in liquid crystals
4.3. Silicon Optical Interconnects
4.3.1. Drivers
4.3.1.1. High interconnects capacity
4.3.1.2. High interconnect density
4.3.1.3. Overcome design issues
4.3.1.4. Overcome timing issues
4.3.2. Inhibitors
4.3.2.1. Large diameters of optical fibers
4.3.2.2. Opportunities
4.3.3. Intra-chip Interconnects
4.3.4. Inter-Chip interconnects
4.3.4.1. Drivers
4.3.4.2. Low connection losses
4.3.4.3. No interference
4.3.4.4. Inhibitors and opportunities
4.3.5. Backplane interconnects
4.4. Wavelength Division Multiplexer Filters
4.4.1. Drivers
4.4.1.1. Straightforward fabrication
4.4.1.2. High neighboring signal isolation
4.4.1.3. Low polarization dependence
4.4.1.4. High thermal stability
4.4.2. Inhibitors
4.4.2.1. Complex thin film growth
4.4.2.2. Filter dependency on wavelengths
4.4.2.3. Opportunity
4.5. Silicon LED
4.6. Silicon Photo detector
4.6.1. Drivers
4.6.1.1. Quick rise and fall times
4.6.1.2. Wide spectral response
4.6.1.3. Wide applications
4.6.1.4. Large acceptance angle
4.6.2. Inhibitors and opportunities
4.6.2.1. Long absorption length
4.6.2.2. Indiscriminate sensitivity to visible radiations

5. Product device
5.1. Silicon Optical Transceivers
5.1.1. Drivers
5.1.1.1. Low electrical power dissipation
5.1.1.2. Increased transmission length
5.1.2. Inhibitors
5.1.2.1. Silicon Lasers cannot be implemented
5.1.3. Opportunities
5.1.3.1. On-chip photo detectors can bring down manufacturing costs
5.1.3.2. Channel characteristics adaptable transceivers
5.2. Silicon Optical Switches
5.2.1. Drivers
5.2.1.1. Carrier injection not needed
5.2.1.2. Low Switching Power
5.2.2. Inhibitors and opportunities
5.3. Silicon photonic IC
5.3.1. Drivers
5.3.1.1. Higher functionality
5.3.1.2. Low Weight
5.3.2. Inhibitors
5.3.3. Opportunities
5.4. Silicon photonic sensors
5.5. Silicon photonic photovoltaic cells/solar cells
5.5.1. Drivers
5.5.1.1. High energy conversion efficiency
5.5.1.2. Easy device fabrication
5.5.1.3. Less silicon needed
5.5.1.4. Challenges and opportunities
5.6. Emerging silicon photonics product devices
5.6.1. Silicon photonic lasers
5.6.2. Silicon photonic amplifiers

6. Silicon photonics Applications
6.1. Telecommunications and Data Transfer
6.1.1. Drivers
6.1.1.1. Quick data transmission
6.1.1.2. Reliable communication
6.1.1.3. Increase in bandwidth
6.1.1.4. Low power requirement
6.1.1.5. Computing and telecommunication convergence
6.1.1.6. No electromagnetic interference
6.1.1.7. Cost reduction
6.1.1.8. Increased integration level of devices
6.1.2. Inhibitors
6.1.2.1. Long-haul communication
6.1.3. Opportunities
6.1.3.1. Short-reach communications
6.1.3.2. Fiber to the Home (FTTH) technology
6.1.4. Optical fiber communications
6.1.4.1. Drivers
6.1.4.2. Inhibitors
6.1.4.3. Opportunities
6.2. Information Processing
6.3. Sensors
6.4. Metrology
6.4.1. Drivers
6.4.1.1. On-chip entanglement
6.4.1.2. Precise real time measurement
6.4.2. Inhibitors and opportunities
6.4.3. Time and frequency measurements
6.4.4. Range finding
6.5. Displays and consumer electronics
6.6. Spectroscopy
6.7. Holography
6.8. Medicine
6.9. Military
6.10. Others
6.11. Emerging silicon photonics Applications
6.11.1. Laser material processing
6.11.2. Visual Art
6.11.3. Robotics

7. Types of silicon structure
7.1. Introduction
7.2. Silicon wafering process
7.3. Single Crystal Silicon (Sc-Si)
7.3.1. The Ribbon Silicon Process
7.3.1.1. Applications
7.4. Multicrystalline Silicon (mc-Si)
7.5. Application and developments of multicrystalline silicon
7.6. Polycrystalline Silicon (pc-Si)
7.6.1. Staebler-Wronski effect
7.6.2. Applications of polycrystalline silicon
7.7. Microcrystalline Silicon (µc-Si)
7.8. Silicon based photonic crystal structures
7.8.1. Market drivers
7.8.1.1. Optically tunable structures
7.8.1.2. Low pump power required
7.8.1.3. Strong angular dispersion
7.8.2. Inhibitors
7.8.2.1. Discrepancy between experimental and theoretical results
7.8.3. Opportunities
7.8.3.1. New modulations devices and multiplexers
7.8.3.2. Crystals are small and compact
7.8.4. One-dimensional structures
7.8.5. Two-dimensional structures
7.8.6. Three-dimensional structures

8. Silicon Light Emissive Structures
8.1. Silicon nanocrystals
8.2. Epitaxial Growth
8.3. Wafer Bonding
9. Silicon growth techniques
9.1. Float Zone (FZ)
9.2. Czochralski’s Crystal growth
9.3. Directional solidification
9.4. Electromagnetic casting
9.5. Dendritic Web Method
9.6. Capillary Die Growth
9.7. Edge-Supported Pulling
9.8. Substrate Melt Shaping
9.9. Thin-Layer Silicon

10. Silicon-Photonics Integration Techniques
10.1. Silicon sub-mount technology
10.2. Silica/Silicon passive waveguide technology
10.3. Passive optical alignment

11. Geographical analysis
11.1. U.S. Silicon Photonics market
11.2. Europe Silicon Photonics market
11.3. asia Silicon Photonics market

12. Challenges in silicon-photonics
12.1. Intervalence band absorption
12.2. Auger Recombination
12.3. Hetero-barrier leakage
13. Company profiles
13.1. Bell Labs
13.2. Chiral Photonics Inc.
13.3. CyOptics
13.4. Enablence Technologies Inc.
13.5. Finisar Corporation
13.6. Hamamatsu Photonics, K.K.
13.7. Hewlett-Packard Co.
13.8. IBM Corp.
13.9. Infinera Inc.
13.10. Innolume
13.11. Intel
13.12. JDS Uniphase Corporation (JDSU)
13.13. Lightwire Inc
13.14. Luxtera, Inc
13.15. Oki Optical Components
13.16. STMicroelectronics
13.17. Sumitomo Mitsubishi Silicon Group (SUMCO) CORPORATION
13.18. Sun Microsystems
13.19. Translucent Inc
14. Patent Analysis
14.1. Appendix
14.1.1. U.S. patent
14.1.2. Europe patent
14.1.3. Asia Patent

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