Lewes, DE -- (SBWIRE) -- 11/25/2015 -- Report forecast the Semiconductor Packaging and Test Market in China to grow at a CAGR of 7.05% by revenue over the period 2014-2019

Semiconductor packaging involves casing of materials such as metal, plastic, glass, or ceramic on the silicon wafer. These casings usually contain one or more semiconductor electronic components. A casing protects the silicon wafer against corrosion and impact, clamps the contact pins or leads used to connect the external circuits to the device, and dissipates heat produced in the device. Though packages are usually made in accordance to industry standards, they meet the specifics of an individual manufacturer.

Wafer testing is executed during the semiconductor device fabrication. This involves the testing of all individual integrated circuits present on the wafer. The individual circuits are tested for functional defects using special test patterns. The testing is carried out using an equipment called a wafer prober or handler. Testing is also carried out using testing methods such as system level tests and burn-in method.

The report covers the present scenario and the growth prospects of the semiconductor packaging and test market in China for 2015-2019 along with a market overview.

The market has been segmented and sub-segmented on the following basis:
By business type :
- IDM (integrated devices manufacturers)
- Outsourced semiconductor assembly and test (OSAT)

According to the report, rapid expansion of semiconductor chip application with growing demands from industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics will drive the market over the forecast period.

Further, the report states that the small life span of the packaging equipment may act as a challenge because the technology used to manufacture semiconductor chips is upgraded constantly and is more optimized.

Semiconductor Packaging and Test Market in China in 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report focuses on the landscape of semiconductor packaging and test market in China market and its opportunities in the coming years. The report includes a discussion of the key vendors operating in this market.

key players in the Semiconductor Packaging and Test Market in China: Amkor Technology, ASE, Powertech Technology, Siliconware Precision Industries (SPIL), STATS ChipPAC and UTAC

Other Prominent Vendors in the market are: ChipMos, Greatek, Huahong, JCET, KYEC, Lingsen Precision, Nepes, SMIC, Tianshui Huatian, and Unisem.

Key market driver
- Growth of semiconductor chip application market
- For a full, detailed list, view our report

Key market challenge
- Short lifecycle of semiconductor devices
- For a full, detailed list, view our report

Key market trend
- Emergence of 3D packaging
- For a full, detailed list, view our report

Key questions answered in this report
- What will the market size be in 2019 in terms of both revenue and unit shipments and what will the growth rate be
- What are the key market trends
- What is driving this market
- What are the challenges to market growth
- Who are the key vendors in this market space
- What are the market opportunities and threats faced by the key vendors

Spanning over 57 pages and 24 Exhibits "Semiconductor Packaging and Test Market in China 2015-2019" report covers Executive summary, Scope of the report, Market research methodology, Introduction, Market landscape, Market segmentation by business type, Market drivers, Impact of drivers, Market challenges, Impact of drivers and challenges, Market trends, Vendor landscape, Key vendor analysis, Appendix.

Find more information Visit at: http://www.marketresearchreports.com/technavio/semiconductor-packaging-and-test-market-china-2015-2019

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