Maharashtra, India -- (SBWIRE) -- 01/07/2019 -- System in Package Market
Summary
In 2018, the global System-in-Package market size was 5220 million US$ and it is expected to reach 10900 million US$ by the end of 2025, with a CAGR of 9.6% during 2019-2025.
SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps.
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Major Features:
The emergence of advanced and compact consumer electronic devices as one of the primary growth factors for this semiconductor packaging market. The consumer electronics devices industry has witnessed a massive transformation in the recent years, where feature phones were replaced by smartphones and personal computers by laptops and tablets. Furthermore, the adoption of the smart homes concept, where electronic devices can be monitored and controlled with the help of mobile applications, will further transition this industry.
This will induce electronic device manufacturers to constantly upgrade their products in terms of several factors such as design, processing power, power consumption, and user-interface, that will require the use of robust technology and develop compact devices. This demand for compact electronic devices will compel semiconductor manufacturers to develop denser ICs with increased circuitry, which will boost the demand for advanced IC packagingtechniques such as SiP.
The key players covered in this study
Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)
...
Market segment by Type, the product can be split into
2D IC
2.5D IC
3D IC
Market segment by Application, split into
Consumer Electronics
Communications
Automotive & Transportation
Aerospace & Defense
Healthcare
Others
Key Regions for this market: North America, Europe, APAC, Latin America, and the Middle East & Africa.
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Technological Advancements
The latest and advanced technologies used in the System in Package Market can be helpful for collaborative seminars, meetings, lectures, and training for industry professionals. Furthermore, in order to introduce advanced products or solutions, leading competitors are expected to concentrate on product innovation through continuous investments in product development.
Key Benefits:
1.The research report provides a detailed analysis of the Chemical Software Market along with the current and future growth prospects so as to shed light on the prominent investment pockets.
2.Information regarding key growth factors, constraints, and opportunities, along with their impact analysis on the Chemical Software Market is provided.
3.Porter's fives forces analysis elaborates the effectiveness of buyers and suppliers operating in the market, globally and regionally.
4.The qualitative and quantitative analysis of the market from 2019 to 2025 is provided to put forth the market potential.
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Key questions answered in the report include:
What will the market size and the growth rate by the end of the forecast period?
What are the key industry trends impacting the growth of the market?
What are the key factors driving and restraining the System in Package market?
What are the challenges to market growth?
What are the market opportunities and threats faced by the key players in the market?
Who are the leading competitors functioning in the market for System in Package?
What are the key outcomes of Porter's five forces analysis of the System in Package market?
Conclusion:
The report concludes with the profiles of major players in the System in Package Market. The foremost market performers are accessed on the basis of various parameters such as company overview, product portfolio, and do on., as well as the latest development trends of the Market.
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