Lewes, DE -- (SBWIRE) -- 06/29/2018 -- The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived at USD 3.6 billion in the first quarter of 2018, up year-on-year but down sequentially. The sequential decline was attributed mainly to the weak seasonal effect and quarter-end inventory clearance at upstream.

The industry is forecast to enjoy both year-on-year and sequential growth in the second quarter of 2018. While smartphone demand is slowing down, HPC (High Performance Computing) and AI applications are to become major growth drivers to push up high-end wafer-level packaging demand and thus the industry is anticipated to maintain slight growth this year.

List of Topics
- This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
- Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
- The content of this report is based on primary data obtained from interviews, and publicly available information.

Spanning over 15 pages "Taiwanese IC Packaging & Testing Industry, 2Q 2018" report covers Companies - Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walto.

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