Edison, NJ -- (SBWIRE) -- 03/05/2019 -- HTF Market Intelligence released a new research report of 120 pages on title 'Global Wafer Level Packaging Market Size Study, by Integration Type (Fan-in wafer Level Packaging, Fan-out Level Packaging) by Packaging Technology (3D TSV WLP, 5D TSV WLP, WLCSP, Nano WLP, Others) by Bumping Technology (Copper Pillar, Solder bumping, Gold bumping, Others) by Industry (Industrial, Automotive, Healthcare, Others) by Regional Forecasts 2017-2025' with detailed analysis, forecast and strategies. The study covers key regions that includes North America, U.S., Canada, Europe, UK, Germany, Asia Pacific, China, India, Japan, Latin America, Brazil, Mexico, Rest of the World and important players such as Amkor Technology, Inc., Fujistu, Jiangsu Changjiang Electronics Technology Co. Ltd., Deca Technologies, Qualcomm Technologies.
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Summary
Global Wafer Level Packaging Market valued approximately USD XXX million in 2016 is anticipated to grow with a healthy growth rate of more than XX.X% over the forecast period 2017-2025.Trending Internet of Things (IoT): a submarket of the overall electronics market
One of the major trends that will gain traction in this market is the increased adoption of semiconductor ICs in automobiles. Several automotive manufacturers have started focusing on the electrification and automation of automobiles. This will increase the need for semiconductors ICs in various products such as GPS, airbag control, anti-lock braking system (ABS), power doors and windows, car navigation and display, infotainment, collision detection technology, and automated driving and will consecutively increase the demand for packaging solutions such as fan-in wafer level packaging.
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Integration Type:
§ Fan-in wafer level packaging
§ Fan-out wafer level packaging
By Packaging Technology:
§ 3D TSV WLP
§ 5D TSV WLP
§ WLCSP
§ Nano WLP
§ Others
By Bumping Technology:
§ Copper pillar
§ Solder Bumping
§ Gold Bumping
§ Others
By Industry:
§ Electronics
§ IT & Telecommunication
§ Industrial
§ Automotive
§ Aerospace & Defense
§ Healthcare
§ Others
By Regions:
§ North America
o U.S.
o Canada
§ Europe
o UK
o Germany
§ Asia Pacific
o China
o India
o Japan
§ Latin America
o Brazil
o Mexico
§ Rest of the World
Furthermore, years considered for the study are as follows:
Historical year – 2015
Base year – 2016
Forecast period – 2017 to 2025
Some of the key manufacturers involved in the market are Amkor Technology, Inc., Fujistu, Jiangsu Changjiang Electronics Technology Co. Ltd., Deca Technologies, Qualcomm Technologies. Acquisitions and effective mergers are some of the strategies adopted by the key manufacturers. New product launches and continuous technological innovations are the key strategies adopted by the major players.
Target Audience of the Global Wafer Level Packaging Market in Market Study:
§ Key Consulting Companies & Advisors
§ Large, medium-sized, and small enterprises
§ Venture capitalists
§ Value-Added Resellers (VARs)
§ Third-party knowledge providers
§ Investment bankers
§ Investors
Companies Mentioned in the Report
Fujitsu
Jiangsu Changjiang Electronics Technology Co.Ltd.
Deca Technologies
Qualcomm Technologies, Inc.
Toshiba Corporation
Tokyo Electron Ltd.
Applied Materials, Inc.
ASML Holding N.V
Lam Research Corporation
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Chapter 1. Global Wafer Level Packaging Market Definition and Scope
1.1. Research Objective
1.2. Market Definition
1.3. Scope of The Study
1.4. Years Considered for The Study
1.5. Currency Conversion Rates
1.6. Report Limitation
Chapter 2. Research Methodology
2.1. Research Process
2.1.1. Data Mining
2.1.2. Analysis
2.1.3. Market Estimation
2.1.4. Validation
2.1.5. Publishing
2.2. Research Assumption
Chapter 3. Executive Summary
3.1. Global & Segmental Market Estimates & Forecasts, 2015-2025 (USD Billion)
3.2. Key Trends
Chapter 4. Global Wafer Level Packaging Market Dynamics
4.1. Growth Prospects
4.1.1. Drivers
4.1.2. Restraints
4.1.3. Opportunities
4.2. Industry Analysis
4.2.1. Porter's 5 Force Model
4.2.2. PEST Analysis
4.2.3. Value Chain Analysis
4.3. Analyst Recommendation & Conclusion
Chapter 5. Global Wafer Level Packaging Market, By Integration Type
5.1. Market Snapshot
5.2. Market Performance - Potential Model
5.3. Global Wafer Level Packaging Market, Sub Segment Analysis
5.3.1. Fan-in wafer level packaging
5.3.1.1. Market estimates & forecasts, 2015-2025 (USD Billion)
5.3.1.2. Regional breakdown estimates & forecasts, 2015-2025 (USD Billion)
5.3.2. Fan-out level packaging
5.3.2.1. Market estimates & forecasts, 2015-2025 (USD Billion)
5.3.2.2. Regional breakdown estimates & forecasts, 2015-2025 (USD Billion)
....Continued
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